AG20P152F-H3D [TAIYO YUDEN]
RESISTOR, VOLTAGE DEPENDENT, THROUGH HOLE MOUNT, RADIAL LEADED;
| 型号： | AG20P152F-H3D |
| 厂家： | 
TAIYO YUDEN (U.S.A.), INC |
| 描述： | RESISTOR, VOLTAGE DEPENDENT, THROUGH HOLE MOUNT, RADIAL LEADED 电阻器 |
| 文件： | 总8页 (文件大小：908K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
スパークギャップ
SPARK GAPS
OPERATING TEMP.
K30VJ85C
特長ꢀFEATURES
Y自己消火性樹脂を用い、安全性が高い
Yもれ電流が極めて小さい
Y静電容量が極めて小さい
YVery safe due to self-extinguishing resin
YLeakage current is very small.
YElectrostatic capacitance is very small.
用途ꢀAPPLICATIONS
YCRT周 辺の異
常電圧吸収
YUsed to absorb abnormal voltages in the periphery of a CRT
形名表記法ꢀORDERING CODE
2
1
3
4
5
外径形状
樹脂材料
P
形式
AG
被覆状態
公称放電開始電圧 [VDC]
10
15
20
40
外形寸法毎の各タイプ
スパークギャップ
アルキド樹脂
Q
樹脂キャップなし
樹脂キャップ付
Q= スペース
122
1200
ꢀ
C
492
4900
ꢀ
ꢀ
6
7
6
8
放電電圧許容差 [V]
リード形状 [mm]
包装
QE
SE
BE
QQ
10、20 タイプ単品 f袋詰め g
15 タイプ単品 f袋詰め g
15 タイプテーピング品
40 タイプ単品 f袋詰め g
Q= スペース
形状
間隔
6.4
6.4
5.0
5.0
6.4
6.4
13
径
長さ
5.0M0.8
24以上
20以上
5.0M1
F
G
H
J
M500
H3D
L3N
Hフォーミング
ストレート
0.65
0.65
0.60
0.60
0.60
0.60
1.0
M800
M2000
2000
1000
K2M
K2U
K4M
K4U
QQQ
Kフォーミング
Kフォーミング
Kフォーミング
Kフォーミング
M
ꢀꢀ
L
M1000
20以上
5.0M1
ストレート(40タイプ）
24以上
A G
1 5 P C 1 2 2 F S K K 2 M
1
2
5
7
8
6
3
4
2
1
3
4
5
Nominal discharge
Type
AG
External dimension
Resin material
Coating conditions
10
15
20
40
Type by external
Spark gaps
P
Alkyd resin
Q
without resin cap
with resin cap
Q=Blank space
starting
voltage[VDC]
ꢀ
dimension
C
122
492
1200
ꢀ
ꢀ
4900
6
7
6
8
Discharge voltage
Packaging
QE
ꢀ SE
BE
QQ
Lead configuration[mm]
Type 10,20 bulk
Type 15, bulk
Type 15, taped
Type 40, bulk
Lead type
Lead space
Diameter
0.65
0.65
0.60
0.60
0.60
0.60
1.0
Length
5.0M0.8
24Min.
20Min.
5.0M1
Tolerance [V]
H3D
L3N
H-formed
6.4
6.4
5.0
5.0
6.4
6.4
13
F
G
H
J
M500
Straight
M800
K2M
K2U
K4M
K4U
QQQ
K-formed
M2000
2000
1000
Q=Blank space
K-formed
M
K-formed
20Min.
5.0M1
L
M1000
K-formed
Straight (40 Type)
25Min.
450
外形寸法ꢀEXTERNAL DIMENSIONS
AG20
Type
リード線
Lead type
AG10
ストレート Straight
L3N
AG15
AG40
Hフォーミング Formed
Kフォーミング Formed
K2M,K2U,K4M,K4U
ストレート Straight
ストレート Straight
QQQfスペースgꢀBlank Space
H3D
L3N
キ
ꢁ
ꢂ
プ
レ
ス
7
本体の厚
さ
本体の厚
さ
本体の厚
さ
本体の厚
さ
本体の厚 さ
Thickness of bodyD3M0.5
f0.118M0.020g
Thickness of bodyD3.5max
Thickness of bodyD4M0.5
Thickness of bodyD4M0.5
f0.157M0.020g
Thickness of bodyD4M0.5
f0.157M0.020g
f0.138maxg
f0.157M0.020g
キ
ꢁ
ꢂ
プ
付
き
E
本体の厚
さ
本体の厚
さ
本体の厚
さ
本体の厚 さ
Thickness of bodyD3M0.5
f0.118M0.020g
Thickness of bodyD4M0.5
f0.157M0.020g
Thickness of bodyD3M0.5
Thickness of bodyD3M0.5
f0.118M0.020g
f0.118M0.020g
UnitDmmfinchg
アイテム一覧ꢀPART NUMBERSꢀ
放電開始電圧
絶縁抵抗
形ꢀ式
Discharge starting voltage fDCg
Insulation
resistance
リード形状
Type
公称値
Nominal value[V]
4000ꢀ4900
許容差
Lead configuration
Tolerance[V] [ME]I1
AG10PG◯◯◯R E L3N
M800、M1000
M 500
10000min
ストレート Straight
AG15PG◯◯◯RG E▽▽▽
1200ꢀ1500ꢀ2000
2500
10000min Kフォーミング K Formed
M 800
ストレート、Hフォーミング
AG20PG◯◯◯R E▽▽▽
AG40PG◯◯◯R
M 500
10000min
10000min
1200ꢀ1500ꢀ2000
2500
Straight ,H Formed
M 800
2000
1000
ストレート Straight
6000ꢀ7000ꢀ8000ꢀ9000
M
M2000
形名のGには被覆状態、◯には放電開始電圧、Rには許容差、☆には包装、▽にはリード形状記号が入ります。
GPlease specify the coating condition code and Z the discharge starting voltage code and R the tolerance code and G the packaging code and I the
lead configuration code.
f注g使用している材料は自己消火性樹脂で、UL94V-0、UL1410fphase ll 規制gを保証するものです。
NoteDThe material used is a self-extinguishing resin conforming to UL94V-0 and UL1410fphase ll regulationg
ꢀꢀꢀI1 AG10、AG15、AG20はDC500V20秒以内の値 です。
ꢀꢀꢀAG40はDC1000V20秒以内の値 です。
I1 Values of AG10,AG15,AG20 are set at DC500V within 20 seconds.
Values of AG40 is set at DC1000V within 20 seconds.
セレクションガイド
Selection Guide
アイテム一覧
Part Numbers
特性図
Electrical Characteristics
梱包
Packaging
信
頼性
使用上の注意
Reliability Data
Precautions
P.12
etc
P.451
P.452
P.453
P.454
P.456
451
特性図ꢀELECTRICAL CHARACTERISTICS
452
外形寸法ꢀEXTERNAL DIMENSIONS
AG20
Type
リード線
Lead type
AG10
ストレート Straight
L3N
AG15
AG40
Hフォーミング Formed
Kフォーミング Formed
K2M,K2U,K4M,K4U
ストレート Straight
ストレート Straight
QQQfスペースgꢀBlank Space
H3D
L3N
キ
ャ
ッ
プ
レ
ス
7
本体の厚
さ
本体の厚
さ
本体の厚
さ
本体の厚
さ
本体の厚 さ
Thickness of bodyD3M0.5
f0.118M0.020g
Thickness of bodyD3.5max
Thickness of bodyD4M0.5
Thickness of bodyD4M0.5
f0.157M0.020g
Thickness of bodyD4M0.5
f0.157M0.020g
f0.138maxg
f0.157M0.020g
キ
ャ
ッ
プ
付
き
E
本体の厚
さ
本体の厚
さ
本体の厚
さ
本体の厚 さ
Thickness of bodyD3M0.5
f0.118M0.020g
Thickness of bodyD4M0.5
f0.157M0.020g
Thickness of bodyD3M0.5
Thickness of bodyD3M0.5
f0.118M0.020g
f0.118M0.020g
UnitDmmfinchg
アイテム一覧ꢀPART NUMBERSꢀ
放電開始電圧
絶縁抵抗
形ꢀ式
Discharge starting voltage fDCg
Insulation
resistance
リード形状
Type
公称値
Nominal value[V]
4000ꢀ4900
許容差
Lead configuration
Tolerance[V] [ME]I1
AG10PG◯◯◯R E L3N
M800、M1000
M 500
10000min
ストレート Straight
AG15PG◯◯◯RG E▽▽▽
1200ꢀ1500ꢀ2000
2500
10000min Kフォーミング K Formed
M 800
ストレート、Hフォーミング
AG20PG◯◯◯R E▽▽▽
AG40PG◯◯◯R
M 500
10000min
10000min
1200ꢀ1500ꢀ2000
2500
Straight ,H Formed
M 800
2000
1000
ストレート Straight
6000ꢀ7000ꢀ8000ꢀ9000
M
M2000
形名のGには被覆状態、◯には放電開始電圧、Rには許容差、☆には包装、▽にはリード形状記号が入ります。
GPlease specify the coating condition code and Z the discharge starting voltage code and R the tolerance code and G the packaging code and I the
lead configuration code.
f注g使用している材料は自己消火性樹脂で、UL94V-0、UL1410fphase ll 規制gを保証するものです。
NoteDThe material used is a self-extinguishing resin conforming to UL94V-0 and UL1410fphase ll regulationg
ꢀꢀꢀI1 AG10、AG15、AG20はDC500V20秒以内の値 です。
ꢀꢀꢀAG40はDC1000V20秒以内の値 です。
I1 Values of AG10,AG15,AG20 are set at DC500V within 20 seconds.
Values of AG40 is set at DC1000V within 20 seconds.
セレクションガイド
Selection Guide
アイテム一覧
Part Numbers
特性図
Electrical Characteristics
梱包
Packaging
信
頼性
使用上の注意
Reliability Data
Precautions
P.12
etc
P.451
P.452
P.453
P.454
P.456
451
梱包ꢀPACKAGING
標準数量 Standard Quantity
標準数量ꢀStandard Quantity [pcs]
Type
袋詰め Bulk
500
テーピング Taped
------
1300F
------
AG10
AG15
AG20
AG40
1000
500
200
------
※K2Mタイプのみ
※Available for K2M type only
テーピング寸法ꢀfK2MタイプgꢀTaping DimensionsfK2M Typeg
7
寸法
記号
Symbol
A
Dimensions
6.8M0.5 f0.268M0.020g
7.0M0.5 f0.276M0.020g
4.0M0.5 f0.157M0.020g
12.7M1.0 f0.500M0.039g
12.7M0.3 f0.500M0.012g
3.85M0.5 f0.152M0.020g
6.35M1.3 f0.250M0.051g
B
T
P
P0
P1
P2
5.0M0.5 f0.197M0.020g
F
J1.0
18.0
f0.709JK00..003209 g
ꢀ
W
K0.5
12.0min f0.472ming
W0
W1
W2
H
9.0 JK0.75 f0.354 JK00.0.03200g
0.5
3.0max f0.118maxg
19.6M0.5 f0.772M0.020g
16.0M0.5 f0.630M0.020g
4.0M0.3 f0.157M0.012g
11.0max f0.433maxg
2.0max f0.079maxg
H0
BD0
L
b
0.75M0.2 f0.030M0.008g
t
Qh1
Qh2
d
2.0max f0.079maxg
0.6M0.05 f0.024M0.002g
UnitDmmfinchg
453
RELIABILITY DATA
1/1
SPARK GAPS
Item
Test Methods and Remarks
Specified Value
1.Operating Temperature
Range
ꢀ
K30CVJ85C
2.Operating Humidity Range
95%RH max. fNo dew condensationg
K40CVJ85C
3.Storage Temperature
ꢀRange
4.Discharge Voltage
Within the specified tolerance
10,000 ME min.
With Circuit 1 shown below, conduct measurement
with voltage application.
5.Insulation Resistance
6.Capacitance
Applied voltageD500VDCfAG10、AG15、AG20g
1000VDCfAG40g
DurationDWithin 20 sec.
7
1pFmax.
Measuring frequencyD1M0.1MHz
Measuring voltageD0.5V5.0Vrms
Bias applicationDNone
With the Circuit 2 shown below, repeat discharge
with specified voltage, followed by the measurement
within 2 to 5 hrs.
7.Discharge
Discharge
ꢀLife
AG10
AG15、AG20、AG40
J20
Voltage
J70
L
Change
L
K35
Number of dischargeD10,000 times
fAG10、AG15、AG20g
K30
Insulation
1000ME
5000ME
ꢀꢀꢀꢀD 5,000 timesfAG40g
TemperatureD40M2C
Resistance
8.Damp Heat
Discharge
HumidityD90V95LRH
J70
L
J50
L
K30
Voltage
Change
K30
DurationD250 hrs
RecoveryD2 to 5 hrs of recovery under the standard
condition after the removal from test chamber.
Insulation
Resistance
1000ME
5000ME
9.Terminal
No damage
Apply the tensile force in the direction to draw terminal.
Applied forceD9.8NfAG10、AG15、AG20g
D39.2NfAG40g
ꢀStrength
Tensile
Apply the bending force to incline the body to right and left
through angle of 90°
No damage
Torsional
Applied forceD4.9NfAG10、AG15、AG20g
D9.8NfAG40g
Circuit 1
Circuit 2
ꢀꢀ AG10、AG15、AG20
ꢀꢀ RD20ME、
ꢀꢀ CD2000pF、
AG40
5ME
AG10、
AG15、AG20
20ME、
AG40
5ME
ꢀꢀ RD 20ME、
ꢀꢀ CD 3000pF、
3000pF
10000pF、
3000pF
ꢀꢀ ED Refer to individual specification
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35C of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20M2C
of temperature, 60 to 70% relative humidity and 86 to 106kPa of air pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
455
1/2
PRECAUTIONS
Precautions on the use of Spark Gaps
Stages
Precautions
Technical considerations
1. Circuit Design
SVerification of operating environment, electrical rating and per-
formance
1. A malfunction in medical equipment, spacecraft, nuclear re-
actors, etc. may cause serious harm to human life or have
severe social ramifications. As such, any Spark Gaps to be
used in such equipment may require higher safety and/or reli-
ability considerations and should be clearly differentiated from
components used in general purpose applications.
SVerification of Rated voltage (DC rated voltage)
7
SOperating Environment precautions
1. Capacitors should not be used in the following environments:
(1)Environmental conditions to avoid
a. exposure to water or salt water.
b. exposure to moisture or condensation.
c. exposure to corrosive gases (such as hydrogen sulfide, sulfu-
rous acid, chlorine, and ammonia)
1. When Spark Gaps are mounted onto a PC board, hole dimen-
sions on the board should match the lead pitch of the compo-
nent, if not it will cause breakage of the terminals or cracking
of terminal roots covered with resin as excess stress travels
through the terminal legs. As a result, humidity resistance
performance would be lost and may lead to a reduction in
2. PCB Design
insulation resistance and cause a withstand voltage failure.
3. Considerations for automatic
insertion
SAdjustment Automatic Insertion machines (leaded components)
1. When inserting Spark Gaps in a PC board by auto-insertion
machines the impact load imposed on the capacitors should
be minimized to prevent the leads from chucking or clinching.
457
2/2
PRECAUTIONS
Precautions on the use of Spark Gaps
Stages
Precautions
Technical considerations
1. Flux is used to increase solderability in wave soldering, but if too much is applied, a large
amount of flux gas may be emitted and may detrimentally affect solderability. To mini-
mize the amount of flux applied, it is recommended to use a flux-bubbling system.
2. With too much halogenated substance (Chlorine, etc.) content is used to activate the
flux, an excessive amount of residue after soldering may lead to corrosion of the terminal
electrodes or degradation of insulation resistance on the surface of the capacitors.
3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the
residue on the surface of capacitors in high humidity conditions may cause a degrada-
tion of insulation resistance and therefore affect the reliability of the components. The
cleaning methods and the capability of the machines used should also be considered
carefully when selecting water-soluble flux.
4. Soldering
SSelection of Flux
1. When soldering Spark Gaps on the board, flux should be ap-
plied thinly and evenly.
2. Flux used should be with less than or equal to 0.1 wt% (equiva-
lent to Chroline) of halogenated content. Flux having a strong
acidity content should not be applied.
3. When using water-soluble flux, special care should be taken
to properly clean the boards.
SWave Soldering
1. If Spark Gaps are used beyond the range of the recommended conditions, heat stresses
may cause cracks inside the Spark Gaps, and consequently degrade the reliability of the
Spark Gaps.
1.Temperature, time, amount of solder, etc. are specified inꢀ
accordance with the following recommended conditions.
2. Do not immerse the entire Spark Gaps in the flux during the
soldering operation. Only solder the lead wires on the bottom
of the board.
7
1. The resin material used for the outer coating of capacitors is occasionally a wax sub-
stance for moisture resistance which can easily be dissolved by some solutions. So
before cleaning, special care should be taken to test the component’s vulnerability to the
solutions used.
5. Cleaning
SBoard cleaning
1. When cleaning the mounted PC boards, make sure that clean-
ing conditions are consistent with prescribed usage conditions.
When using water-soluble flux please clean the PCB with purified water sufficiently and
dry thoroughly at the end of the process. Insufficient washing or drying could lower the
reliability of the capacitors.
6. Post-cleaning-process
SApplication of resin molding, etc. to the PCB and components. 1-1. The thermal expansion and coefficient of contraction of the molded resin are not neces-
sarily matched with those of the Spark Gaps. The Spark Gaps may be exposed to
1. Please contact your local Taiyo Yuden sales office before per-
stresses due to thermal expansion and contraction during and after hardening. This
forming resin coating or molding on mounted capacitors.
may lower the specified characteristics and insulation resistance or cause reduced with-
Please verify on the actual application that the coating pro-
stand voltage by cracking the ceramic or separating the coated resin from the ceramics.
cess will not adversely affect the component quality.
1-2. With some types of mold resins, the resin's decomposition gas or reaction gas may
remain inside the resin during the hardening period or while left under normal condi-
tions, causing a deterioration of the capacitor's performance.
1-3. Some mold resins may have poor moisture proofing properties. Please verify the
contents of the resins before they are applied.
1-4. Please contact Taiyo Yuden before using if the hardening process temperature of the
mold resins is higher than the operating temperature of the Spark Gaps.
7. Handling
SMechanical considerations
1. Because the Spark Gaps is made of ceramic, mechanical shocks applied to the board
may damage or crack the Spark Gaps.
1. Be careful not to subject the Spark Gaps to excessive me-
chanical shocks. Withstanding voltage failure may result.
2. If Spark Gaps are dropped onto the floor or a hard surface
they should not be used.
2.Spark Gaps which are dropped onto the floor or a hard surface may develop defects and
have a higher risk of failure over time.
8. Storage conditions
SStorage
1. Under high temperature/high humidity conditions, the decrease in solderability due to
the oxidation of terminal electrodes and deterioration of taping and packaging character-
istics may be accelerated.
1. To maintain the solderability of terminal electrodes and to keep
the packaging material in good condition, care must be taken
to control temperature and humidity in the storage area. Hu-
midity should especially be kept as low as possible. Recom-
mended conditions: Ambient temperature Below 40 C Humid-
ity Below 70% RH. Products should be used within 12 months
after delivery. After the above period, the solderability should
be checked before using the Spark Gaps.
2. Spark Gaps should not be kept in an environment filled with
decomposition gases such as (sulfurous hydrogen, sulfurous
acid, chlorine, ammonia, etc.)
3. Spark Gaps should not be kept in a location where they may
be exposed to moisture, condensation or direct sunlight.
459
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